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High Temperature Masking Tape Labels

High Temperature Masking Tape Labels

Overview Specifications Recommendations
High Temperature Masking Tape Labels
High Temperature Masking Tape Labels
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049137 has been discontinued.
Replacement Product:
We recommend this product which provides similar performance
High Temperature Masking Tape Labels

High Temperature Masking Tape Labels

CMKC-375-PK
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Order Reference:

049137

DISCONTINUED

Overview

Circuit Board Solder Masks are designed to withstand high-temperature applications where clean removal is necessary.

  • Transparent die-cut masks withstand solder fluxes, molten solder and cleaning/degreasing solvents used in the manufacture of printed circuit boards
  • B-654 High Temperature Polyimide Film with removable silicone adhesive from Brady® leaves no residue when removed from most surfaces
  • Withstands solder fluxes, molten solder and cleaning/degreasing solvents used in the manufacture of printed circuit boards
  • Good smudge, chemical, oil and water resistance

Specifications

Key Characteristics
Key Characteristics Article Number 049137
Order Reference CMKC-375
Total Qty per Pack 1800 Label(s) / Pack
Minimum Order Quanitity 1
Application(s) Circuit board labelling
Quantity 72
Board Application After Process, Surface Mount Technology (SMT) - Top/Bottom
Brand Brady®
Country of Origin US

Dimensions
Dimensions Size - Diameter (mm) 9.53 mm
Dimensions 9,53 mm (Dia)

Material Characteristics
Material Characteristics Brady Material No. B-654 (View Technical Data Sheet)
Brady Material Type Polyimide
Thickness (mm) 0.064 mm
Colour Amber
Max. Service Temp. °C 240 °C
Adhesive Removable Silicone
After Process Yes, this material will work with this application
Finish Gloss
Surface Mount Technology SMT Yes, this material will work with this application

Product Features
Product Features Shape Circle

Compliance
Compliance UNSPSC 55122002
RoHS Compliance Status Compliant with Directive 2011/65/EU and 2015/863
REACH SVHC Status Part does not contain an SVHC
REACH Candidate List Date 15 January 2019

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